Step By Step Manufacturing Of PCB
Manufacturing of PCB has been simplified through innovation and advancement in technology. You will require a photo resist board which forms the basics of the entire assembly. This is a piece of glass with reinforcements made of plastic. On the one end is a photo sensitive copper coating. It is by peeling this plastic film that one reveals the photo sensitive coating.
You will then place the now transparent printed circuit board beneath the photo resist board. They should be of exact same size. The surface is sensitive after the removal of the plastic film. Placing the mask in the right way-up ensures that the tracks do not end up facing the wrong direction. The board is then ready for transfer into the UV light box.
The lid to the box should be appropriate in order to make the box completely covered. The box should be switched on for about two and half minutes. This board should only be handled using plastic tongs because of its delicate nature. The board is then transferred into the development box. It takes slightly more or less than ten seconds in this box and then it is removed. Extending time in this box is dangerous and could destroy it completely.
Plastic tongs are used to transfer the board to the etching tank after it has been thoroughly cleaned using water. The box is switched on for heating until bubbles form. This process is supposed to remove excel copper material in order to leave the tracks clean and clear. This process should be closely monitored to ensure that the tracks are not damaged.
Etching will take approximately fifteen minutes. Under-etching exposes the board incomplete development while it will get damaged when etching is overdone. The tracks are likely to be removed in the process. The process of manufacture should be monitored by the minute and will eventually be mastered.
Technology has simplified the process of design since a Computer Aided Design system or Auto CAD may be used. The data is easier to in-script and transfer to manufacturers. This automated system defines and earmarks your copper layers. It makes it easier and clear to identify soldier marks and component notifications.
Laser photoplotters are used during preparation of photo tools. This is done in a controlled dark room where the humidity and temperatures are monitored. The board data is taken for conversion into an image based on pixels. Writing on the film is done using a laser writer as well. Upon exposure, the film has developed automatically and is ready for unloading for the operator.
Manufacturing of PCB is not complete until profiling or V-cut scoring is done. This is done from the production panel. A scoring machine is used in this process. Cutters are either above or below the panel. The cut is made at a third of the entire thickness in order to leave a film that connects the board together. The board is then checked thoroughly by an experienced person to ensure that everything is in order.
You will then place the now transparent printed circuit board beneath the photo resist board. They should be of exact same size. The surface is sensitive after the removal of the plastic film. Placing the mask in the right way-up ensures that the tracks do not end up facing the wrong direction. The board is then ready for transfer into the UV light box.
The lid to the box should be appropriate in order to make the box completely covered. The box should be switched on for about two and half minutes. This board should only be handled using plastic tongs because of its delicate nature. The board is then transferred into the development box. It takes slightly more or less than ten seconds in this box and then it is removed. Extending time in this box is dangerous and could destroy it completely.
Plastic tongs are used to transfer the board to the etching tank after it has been thoroughly cleaned using water. The box is switched on for heating until bubbles form. This process is supposed to remove excel copper material in order to leave the tracks clean and clear. This process should be closely monitored to ensure that the tracks are not damaged.
Etching will take approximately fifteen minutes. Under-etching exposes the board incomplete development while it will get damaged when etching is overdone. The tracks are likely to be removed in the process. The process of manufacture should be monitored by the minute and will eventually be mastered.
Technology has simplified the process of design since a Computer Aided Design system or Auto CAD may be used. The data is easier to in-script and transfer to manufacturers. This automated system defines and earmarks your copper layers. It makes it easier and clear to identify soldier marks and component notifications.
Laser photoplotters are used during preparation of photo tools. This is done in a controlled dark room where the humidity and temperatures are monitored. The board data is taken for conversion into an image based on pixels. Writing on the film is done using a laser writer as well. Upon exposure, the film has developed automatically and is ready for unloading for the operator.
Manufacturing of PCB is not complete until profiling or V-cut scoring is done. This is done from the production panel. A scoring machine is used in this process. Cutters are either above or below the panel. The cut is made at a third of the entire thickness in order to leave a film that connects the board together. The board is then checked thoroughly by an experienced person to ensure that everything is in order.
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